MAX1718.pdf

(699 KB) Pobierz
323064338 UNPDF
19-1960; Rev 3; 8/02
Notebook CPU Step-Down Controller for Intel
Mobile Voltage Positioning (IMVP - II)
General Description
The MAX1718 step-down controller is intended for core
CPU DC-DC converters in notebook computers. It fea-
tures a dynamically adjustable output, ultra-fast transient
response, high DC accuracy, and high efficiency need-
ed for leading-edge CPU core power supplies. Maxim’s
proprietary Quick-PWM™ quick-response, constant-on-
time PWM control scheme handles wide input/output
voltage ratios with ease and provides 100ns “instant-on”
response to load transients while maintaining a relatively
constant switching frequency.
The output voltage can be dynamically adjusted through
the 5-bit digital-to-analog converter (DAC) over a 0.6V to
1.75V range. The MAX1718 has an internal multiplexer
that accepts three unique 5-bit VID DAC codes corre-
sponding to Performance, Battery, and Suspend modes.
Precision slew-rate control provides “just-in-time” arrival
at the new DAC setting, minimizing surge currents to
and from the battery.
The internal DAC of the MAX1718B is synchronized to
the slew-rate clock for improved operation under
aggressive power management of newer chipsets and
operating systems that can make incomplete mode tran-
sitions.
A pair of complementary offset control inputs allows
easy compensation for IR drops in PC board traces or
creation of a voltage-positioned power supply. Voltage-
positioning modifies the load-transient response to
reduce output capacitor requirements and total system
power dissipation.
Single-stage buck conversion allows these devices to
directly step down high-voltage batteries for the highest
possible efficiency. Alternatively, two-stage conversion
(stepping down the 5V system supply instead of the bat-
tery) at a higher switching frequency allows the mini-
mum possible physical size.
The MAX1718 is available in a 28-pin QSOP package.
Features
Quick-PWM Architecture
±1% V OUT Accuracy Over Line and Load
5-Bit On-Board DAC with Input Muxes
Precision-Adjustable V OUT Slew Control
0.6V to 1.75V Output Adjust Range
Precision Offset Control
Supports Voltage-Positioned Applications
2V to 28V Battery Input Range
Requires a Separate 5V Bias Supply
200/300/550/1000kHz Switching Frequency
Over/Undervoltage Protection
Drives Large Synchronous-Rectifier FETs
700µA (typ) I CC Supply Current
2µA (typ) Shutdown Supply Current
2V ±1% Reference Output
VGATE Blanking During Transition
Small 28-Pin QSOP Package
Ordering Information
PART
TEMP RANGE
PIN-PACKAGE
MAX1718EEI
-40
°
C to +85
°
C
28 QSOP
MAX1718BEEI
-40 ° C to +85 ° C
28 QSOP
Minimal Operating Circuit
5V I NP UT
V CC
V DD
BATT 2 V TO 28V
SKP/SDN
ILIM
V+
SHUTDOWN
BST
MAX1718
DH
OUTPUT
0.6 V T O 1.75V
D0
D1
D2
LX
DUAL MODE VID
MUX INPUTS
Applications
IMVP-II™ Notebook Computers
2-Cell to 4-Cell Li+ Battery to CPU Core Supply
Converters
5V to CPU Core Supply Converters
D3
D4
DL
GND
ZMODE
MUX CONTROL
SUSPEND
INPUT
DECODER
SUS
S0
S1
FB
TIME
NEG
Pin Configuration appears at end of data sheet.
V CC
CC
POS
REF
Patent pending.
Quick-PWM is a trademark of Maxim Integrated Products.
IMVP-II is a trademark of Intel Corp.
TON
VGATE
OVP
POWER-GOOD
OUTPUT
________________________________________________________________ Maxim Integrated Products 1
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.
323064338.051.png 323064338.060.png 323064338.061.png 323064338.062.png 323064338.001.png 323064338.002.png 323064338.003.png 323064338.004.png 323064338.005.png 323064338.006.png 323064338.007.png 323064338.008.png 323064338.009.png 323064338.010.png 323064338.011.png 323064338.012.png 323064338.013.png 323064338.014.png 323064338.015.png 323064338.016.png 323064338.017.png 323064338.018.png 323064338.019.png 323064338.020.png 323064338.021.png 323064338.022.png 323064338.023.png 323064338.024.png 323064338.025.png 323064338.026.png 323064338.027.png 323064338.028.png 323064338.029.png 323064338.030.png 323064338.031.png 323064338.032.png 323064338.033.png 323064338.034.png 323064338.035.png 323064338.036.png 323064338.037.png 323064338.038.png 323064338.039.png 323064338.040.png 323064338.041.png 323064338.042.png 323064338.043.png 323064338.044.png 323064338.045.png 323064338.046.png 323064338.047.png 323064338.048.png 323064338.049.png 323064338.050.png 323064338.052.png 323064338.053.png 323064338.054.png 323064338.055.png
Notebook CPU Step-Down Controller for Intel
Mobile Voltage Positioning (IMVP - II)
ABSOLUTE MAXIMUM RATINGS
V+ to GND ..............................................................-0.3V to +30V
V CC , V DD to GND .....................................................-0.3V to +6V
D0–D4, ZMODE, VGATE, OVP, SUS, to GND .........-0.3V to +6V
SKP/SDN to GND ...................................................-0.3V to +16V
ILIM, CC, REF, POS, NEG, S1, S0,
TON, TIME to GND .................................-0.3V to (V CC + 0.3V)
DL to GND ..................................................-0.3V to (V DD + 0.3V)
BST to GND ............................................................-0.3V to +36V
DH to LX .....................................................-0.3V to (BST + 0.3V)
LX to BST..................................................................-6V to +0.3V
REF Short Circuit to GND ...........................................Continuous
Continuous Power Dissipation
28-Pin QSOP (derate 10.8mW/°C above +70°C).........860mW
Operating Temperature Range ..........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature.........................................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(Circuit of Figure 1, V+ = 15V, V CC = V DD = SKP/SDN = 5V, V OUT = 1.25V, T A = 0°C to +85°C , unless otherwise noted.)
PARAMETER
CONDITIONS
MIN
TYP
MAX UNITS
PWM CONTROLLER
Input Voltage Range
Battery voltage, V+
V CC , V DD
2
28
V
4.5
5.5
V+ = 4.5V to 28V,
includes load
regulation error
DAC codes from 0.9V to 1.75V
-1
+1
%
DC Output Voltage Accuracy
DAC codes from 0.6V to 0.875V
-1.5
+1.5
%
Line Regulation Error
V CC = 4.5V to 5.5V, V BATT = 4.5V to 28V
5
mV
Input Bias Current
FB, POS, NEG
-0.2
+0.2
µA
V
POS, NEG Common-Mode Range
0.4
2.5
POS, NEG Differential Range
POS - NEG
-80
+80
mV
POS, NEG Offset Gain
V FB / (POS - NEG); POS - NEG = 50mV
0.81
0.86
0.91
V/V
150kHz nominal, R TIME = 120k
-8
+8
TIME Frequency Accuracy
380kHz nominal, R TIME = 47k
-12
+12
%
V+ = 5V, FB = 1.2V, TON = GND (1000kHz)
-12
+12
230
260
290
On-Time (Note 1)
TON = REF (550kHz)
TON = open (300kHz)
TON = V CC (200kHz)
165
190
215
ns
V+ = 12V, FB = 1.2V
320
355
390
465
515
565
Minimum Off-Time (Note 1)
TON = V CC , open, or REF (200kHz, 300kHz, or 550kHz)
TON = GND (1000kHz)
400
500
ns
300
375
BIAS AND REFERENCE
Quiescent Supply Current (V CC )
Quiescent Supply Current (V DD ) Measured at V DD , FB forced above the regulation point
Measured at V CC , FB forced above the regulation point
700
1200
µA
<1
5
µA
Quiescent Battery Supply
Current (V+)
Shutdown Supply Current (V CC )
Shutdown Supply Current (V DD )
25
40
µA
SKP/SDN = GND
SKP/SDN = GND
2
5
µA
µA
<1
5
Shutdown Battery Supply
Current (V+)
Reference Voltage
SKP/SDN = GND, V CC = V DD = 0V or 5V
<1
5
µA
V CC = 4.5V to 5.5V, no REF load
1.98
2
2.02
V
2 _______________________________________________________________________________________
38kHz nominal, R TIME = 470k
323064338.056.png
Notebook CPU Step-Down Controller for Intel
Mobile Voltage Positioning (IMVP - II)
ELECTRICAL CHARACTERISTICS (continued)
(Circuit of Figure 1, V+ = 15V, V CC = V DD = SKP/SDN = 5V, V OUT = 1.25V, T A = 0°C to +85°C , unless otherwise noted.)
PARAMETER
CONDITIONS
MIN
TYP
MAX UNITS
Reference Load Regulation
I REF = 0µA to 50µA
0.01
V
REF Sink Current
REF in regulation
10
µA
FAULT PROTECTION
Overvoltage Trip Threshold
Measured at FB
1.95
2.00
2.05
V
Overvoltage Fault Propagation
Delay
FB forced 2% above trip threshold
10
µs
Output Undervoltage Fault
Protection Threshold
With respect to unloaded output voltage
65
70
75
%
Output Undervoltage Fault
Propagation Delay
FB forced 2% below trip threshold
10
µs
Output Undervoltage Fault
Blanking Time
From SKP/SDN signal going high, clock speed set by R TIME
256
clks
Current-Limit Threshold Voltage
(Positive, Default)
GND - LX, ILIM = V CC
T A = +25°C to +85°C
90
100
110
T A = 0°C to +85°C
85
115
mV
Current-Limit Threshold Voltage
(Positive, Adjustable)
GND - LX
ILIM = 0.5V
35
50
65
mV
ILIM = REF (2V)
165
200
230
Current-Limit Threshold Voltage
(Negative)
LX - GND, ILIM = V CC
-140
-117
-95
mV
Current-Limit Threshold Voltage
(Zero Crossing)
GND - LX
4
mV
Current-Limit Default
Switchover Threshold
3 CC -1 V CC -0.4
V
Thermal Shutdown Threshold
Hysteresis = 10°C
150
°C
V CC Undervoltage Lockout
Threshold
Rising edge, hysteresis = 20mV, PWM disabled below
this level
4.1
4.4
V
VGATE Lower Trip Threshold
Measured at FB with respect to unloaded output voltage
-12
-10
-8
%
VGATE Upper Trip Threshold
Measured at FB with respect to unloaded output voltage
+8
+10
+12
%
VGATE Propagation Delay
FB forced 2% outside VGATE trip threshold
10
µs
VGATE Output Low Voltage
I SINK = 1mA
0.4
V
VGATE Leakage Current
High state, forced to 5.5V
1
µA
GATE DRIVERS
DH Gate Driver On-Resistance
BST - LX forced to 5V
1.0
3.5
DL Gate Driver On-Resistance
DL, high state (pullup)
DL, low state (pulldown)
1.0
1.0
0.4
DH Gate-Driver Source/Sink
Current
DH forced to 2.5V, BST - LX forced to 5V
1.6
A
DL Gate-Driver Sink Current
DL forced to 2.5V
4
A
_______________________________________________________________________________________ 3
3.5
323064338.057.png
Notebook CPU Step-Down Controller for Intel
Mobile Voltage Positioning (IMVP - II)
ELECTRICAL CHARACTERISTICS (continued)
(Circuit of Figure 1, V+ = 15V, V CC = V DD = SKP/SDN = 5V, V OUT = 1.25V, T A = 0°C to +85°C , unless otherwise noted.)
PARAMETER
CONDITIONS
MIN
TYP
MAX UNITS
A
DL Gate-Driver Source Current
DL forced to 2.5V
1.6
Dead Time
DL rising
35
ns
DH rising
26
LOGIC AND I/O
Logic Input High Voltage
D0–D4, ZMODE, SUS, OVP
2.4
V
Logic Input Low Voltage
D0–D4, ZMODE, SUS, OVP
0.8
V
DAC B-Mode Programming
Resistor, Low
D0–D4, 0 to 0.4V or 2.6V to 5.5V applied through resistor,
ZMODE = V CC
1.05
k
DAC B-Mode Programming
Resistor, High
D0–D4, 0 to 0.4V or 2.6V to 5.5V applied through resistor,
ZMODE = V CC
95
k
D0–D4 Pullup/Pulldown
Entering impedance mode
Pullup
Pulldown
40
8
k
Logic Input Current
D0–D4, ZMODE = GND
ZMODE, SUS, OVP
-1
+1
µA
-1
+1
4 Level Input Logic Levels
(TON, S0, S1)
For high
For open
For REF
For low
V CC - 0.4
3.15
3.85
V
1.65
2.35
0.5
SKP/SDN, S0, S1, and TON Input
Current
SKP/SDN, S0, S1, TON forced to GND or V CC
-3
+3
µA
SKP/SDN = logic high (SKIP mode)
SKP/SDN = open (PWM mode)
SKP/SDN = logic low (shutdown mode)
To enable no-fault mode
2.8
6
SKP/SDN Input Levels
1.4
2.2
V
0.5
12
15
SKP/SDN Float Level
I SKP/SDN = 0µA
1.8
2.2
V
ELECTRICAL CHARACTERISTICS
(Circuit of Figure 1, V+ = 15V, V CC = V DD = SKP/SDN = 5V, V OUT = 1.25V, T A = -40°C to +85°C , unless otherwise noted.) (Note 2)
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
PWM CONTROLLER
V+ = 4.5V to 28V,
includes load
regulation error
DAC codes from 0.9V to 1.75V
-1.5
+1.5
DC Output Voltage Accuracy
%
DAC codes from 0.6V to 0.875V
-2.0
+2.0
150kHz nominal, R TIME = 120k
-8
+8
TIME Frequency Accuracy
380kHz nominal, R TIME = 47k
-12
+12
%
38kHz nominal, R TIME = 470k
-12
+12
V+ = 5V, FB = 1.2V, TON = GND (1000kHz)
230
290
On-Time (Note 1)
TON = REF (550kHz)
165
215
ns
V+ = 12V, FB = 1.2V
TON = open (300kHz)
320
390
TON = V CC (200kHz)
465
565
4 _______________________________________________________________________________________
323064338.058.png
Notebook CPU Step-Down Controller for Intel
Mobile Voltage Positioning (IMVP - II)
ELECTRICAL CHARACTERISTICS (continued)
(Circuit of Figure 1, V+ = 15V, V CC = V DD = SKP/SDN = 5V, V OUT = 1.25V, T A = -40°C to +85°C , unless otherwise noted.) (Note 2)
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
Minimum Off-Time (Note 1)
TON = V CC , open, or REF (200kHz, 300kHz, or 550kHz)
500
ns
TON = GND (1000kHz)
375
BIAS AND REFERENCE
Quiescent Supply Current (V CC )
Measured at V CC , FB forced above the regulation point
1300
µA
Quiescent Supply Current (V DD )
Measured at V DD , FB forced above the regulation point
5
µA
Quiescent Battery Supply
Current (V+)
40
µA
Shutdown Supply Current (V CC )
SKP/SDN = 0
5
µA
Shutdown Supply Current (V DD )
SKP/SDN = 0
5
µA
Shutdown Battery Supply
Current (V+)
SKP/SDN = 0, V CC = V DD = 0 or 5V
5
µA
Reference Voltage
V CC = 4.5V to 5.5V, no REF load
1.98
2.02
V
FAULT PROTECTION
Overvoltage Trip Threshold
Measured at FB
1.95
2.05
V
Output Undervoltage Protection
Threshold
With respect to unloaded output voltage
65
75
%
Current-Limit Threshold Voltage
(Positive, Default)
GND - LX, ILIM = V CC
80
115
mV
Current-Limit Threshold Voltage
(Positive, Adjustable)
GND - LX
ILIM = 0.5V
ILIM = REF (2V)
33
65
mV
160
240
Current-Limit Threshold Voltage
(Negative)
LX - GND, ILIM = V CC
-145
-90
mV
V CC Undervoltage Lockout
Threshold
Rising edge, hysteresis = 20mV, PWM disabled below this
level
4.1
4.4
V
VGATE Lower Trip Threshold
Measured at FB with respect to unloaded output voltage
-12.5
-7.5
%
VGATE Upper Trip Threshold
Measured at FB with respect to unloaded output voltage
+7.5
+12.5
%
GATE DRIVERS
DH Gate Driver On-Resistance
BST - LX forced to 5V
3.5
DL Gate Driver On-Resistance
DL, high state (pullup)
3.5
DL, low state (pulldown)
1.0
_______________________________________________________________________________________ 5
323064338.059.png
Zgłoś jeśli naruszono regulamin