KIA7019_KIA7045.pdf

(415 KB) Pobierz
KIA7019-45AP/AF/AT
SEMICONDUCTOR
TECHNICAL DATA
KIA7019AP/AF/AT~
KIA7045AP/AF/AT
BIPOLAR LINEAR INTEGRATED CIRCUIT
VOLTAGE DETECTOR
B
C
Function of this IC is accurately resetting the system after
detecting voltage at the time of switching power on and instantaneous
power off in various CPU systems and other logic systems.
N
E
DIM
MILLIMETERS
K
G
A
4.70 MAX
B
4.80 MAX
D
C
3.70 MAX
FEATURES
Current Consumption is Low. I CCL =300 A Typ. I CCH =30 A Typ.
Resetting Output Minimum Guarantee Voltage is Low 0.8V Typ.
Hysteresis Voltage is Provided. 50mV Typ.
Reset Signal Generation Starting Voltages :
KIA7019 1.9V Typ. KIA7033 3.3V Typ.
KIA7021 2.1V Typ. KIA7034 3.4V Typ.
KIA7023 2.3V Typ. KIA7035 3.5V Typ.
KIA7025 2.5V Typ. KIA7036 3.6V Typ.
KIA7027 2.7V Typ. KIA7039 3.9V Typ.
KIA7029 2.9V Typ. KIA7042 4.2V Typ.
KIA7031 3.1V Typ. KIA7045 4.5V Typ.
KIA7032 3.2V Typ.
Taping Type is also Available.
D
0.45
E
1.00
F
1.27
G
0.85
H
H
0.45
F
F
J
14.00 0.50
_
K
0.55 MAX
L
2.30
M
0.45 MAX
1
2
3
N
1.00
1. V CC
2. GND
3. OUT
TO-92
A
C
H
G
DIM
A
B
MILLIMETERS
D
D
4.70 MAX
2.50 0.20
1.70 MAX
0.45+0.15/-0.10
4.25 MAX
1.50 0.10
0.40 TYP
1.75 MAX
0.75 MIN
0.5+0.10/-0.05
APPLICATIONS
(1) As Control Circuit of Battery-Backed Memory.
(2) As Measure Against Erroneous Operations at Power ON-OFF.
(3) As Measure Against System Runaway at Instantaneous Break
of Power Supply etc.
(4) As Resetting Function for the CPU-Mounted Equipment,
such as Personal Computers, Printers, VTRs and so forth.
K
C
D
E
F F
F
_
G
H
J
1
2
3
K
1. V CC
2. GND
3. OUT
EQUIVALENT CIRCUIT
SOT-89
V CC
OUT
E
+
K
B
K
DIM MILLIMETERS
A
B
-
2.9 0.2
1.6+0.2/-0.1
0.70 0.05
0.4 0.1
2.8+0.2/-0.3
1.9 0.2
0.95
0.16 0.05
0.00-0.10
0.25+0.25/-0.15
2
C
_
_
3
D
E
GND
1
F
G
H
I
J
K
_
_
Marking
0.60
L
0.55
Type No.
Marking
Type No.
Marking
Type No.
Marking
H
J
J
KIA7019AF/AT
6A
KIA7029AF/AT
6F
KIA7035AF/AT
6L
KIA7021AF/AT
6B
KIA7031AF/AT
6G
KIA7036AF/AT
6M
1. V CC
2. OUT
3. GND
2
3
KIA7023AF/AT
6C
KIA7032AF/AT
6H
KIA7039AF/AT
6N
1
KIA7025AF/AT
6D
KIA7033AF/AT
6J
KIA7042AF/AT
6P
KIA7027AF/AT
6E
KIA7034AF/AT
6K
KIA7045AF/AT
6R
TSM
2002. 12. 31
Revision No : 2
1/4
_
_
383659001.051.png 383659001.057.png 383659001.058.png 383659001.059.png 383659001.001.png 383659001.002.png 383659001.003.png 383659001.004.png 383659001.005.png 383659001.006.png 383659001.007.png 383659001.008.png
KIA7019AP/AF/AT~KIA7045AP/AF/AT
MAXIMUM RATINGS (Ta=25 )
CHARACTERISTIC
SYMBOL
RATING
UNIT
Supply Voltage
V CC
-0.3 +15.0
V
KIA7019AP 45AP
400
Power Dissipation (Package Limitation)
KIA7019AF 45AF
P D
500
mW
KIA7019AT 45AT
350
Operating Temperature
T opr
-30 +75
Storage Temperature
T stg
-55 +150
ELECTRICAL CHARACTERISTICS (V CC =5V, V EE =GND, Ta=25 )
CHARACTERISTIC
SYMBOL
TEST
CIRCUIT
TEST CONDITION
MIN.
TYP.
MAX.
UNIT
Detecting Voltage
V S
1
R L =200
V OL 0.4V
KIA7019
KIA7021
KIA7023
KIA7025
KIA7027
KIA7029
KIA7031
KIA7032
KIA7033
KIA7034
KIA7035
KIA7036
KIA7039
KIA7042
KIA7045
1.75
1.95
2.15
2.35
2.55
2.75
2.95
3.05
3.15
3.25
3.35
3.45
3.75
4.05
4.35
1.9
2.1
2.3
2.5
2.7
2.9
3.1
3.2
3.3
3.4
3.5
3.6
3.9
4.2
4.5
2.05
2.25
2.45
2.65
2.85
3.05
3.25
3.35
3.45
3.55
3.65
3.75
4.05
4.35
4.65
V
Low-Level Output Voltage
V OL
1
R L =200
-
-
0.4
V
Output Leakage Current
I OH
1
V CC =15V
-
-
0.1
A
Hysteresis Voltage
Vs
1
R L =200
30
50
100
mV
Detecting Voltage
Temperature Coefficient
Vs/ T
1
R L =200
-
0.01
-
%/
Circuit Current at on Time
IccL
1
V CC =Vsmin.-0.05V
-
300
500
A
Circuit Current at off Time
IccH
1
V CC =5.25V
-
30
50
A
Threshold Operating Voltage
Vopr
1
R L =200 , V OL 0.4V
-
0.8
-
V
"L" Transmission Delay Time
tpHL
2
R L =1.0k , C L =100pF
-
10
-
s
"H" Transmission Delay Time
tpLH
2
R L =1.0k , C L =100pF
-
15
-
s
Output Current at on Time I
IoL I
1
V CC =Vsmin.-0.05V, Tc=25
20
-
-
mA
Output Current at on Time II
IoL II
1
V CC =Vsmin.-0.05V, Tc=-30 +75
16
-
-
mA
2002. 12. 31
Revision No : 2
2/4
383659001.009.png 383659001.010.png 383659001.011.png 383659001.012.png 383659001.013.png 383659001.014.png 383659001.015.png 383659001.016.png 383659001.017.png 383659001.018.png 383659001.019.png 383659001.020.png 383659001.021.png 383659001.022.png 383659001.023.png 383659001.024.png 383659001.025.png 383659001.026.png 383659001.027.png 383659001.028.png 383659001.029.png 383659001.030.png 383659001.031.png 383659001.032.png 383659001.033.png 383659001.034.png 383659001.035.png 383659001.036.png 383659001.037.png 383659001.038.png 383659001.039.png 383659001.040.png
KIA7019AP/AF/AT~KIA7045AP/AF/AT
TEST CIRCUIT 1.
A1
A2
1
R L
V1
KIA70XX
3
2
10uF/10V
M
TEST CIRCUIT 2.
1
R L
KIA70XX
3
10uF/10V
5.0V
Input
Pulse
0.2uF
/10V
2
C
L
M
APPLICATION CIRCUIT
(1) BATTERY LOW INDICATOR
(2) CPU RESETTING
V CC
C VV
1
R2
1
R1
V CC
KIA70XX
3
KIA70XX
3
Reset
CPU
LED
GND
2
2
C1
V CC 5V
V
S
Delay Time for Power ON
Reset
(NOTE)
(1) Connecting of LED and R2 obtains a voltage drop indicator.
(2) Connecting of C1 and selection of time constant with C1 and R1 set
the power on delay time.
2002. 12. 31
Revision No : 2
3/4
383659001.041.png 383659001.042.png 383659001.043.png 383659001.044.png 383659001.045.png 383659001.046.png
KIA7019AP/AF/AT~KIA7045AP/AF/AT
PRECAUTION FOR USE
SOLDERING
Flat Package (SOT-89 Package)
Elements mounting styles of electronic devices are gaining in further diversification over recent years, and needs for
components are all the more expanding in varieties. Especially, surface mounting is steadily penetrating into industrial
segments as a world-wide popular technical trend. Although exposure to high temperature is inevitable during soldering
we recommend limiting the soldering temperature to low levels as shown in figure for the sake of retaining inherent
excellent reliability.
240
210
150
60 sec.
Time (sec.)
Within 10 sec.
Within 30 sec.
Fig 6
(a) When employing solder reflow method
Atmospheric temperature around resin surfaces must be less than 240 , not exceeding the time length of 10 sec.
Recommend temperature profile
Precautions on heating method
When resin in kept exposed to high temperature for a long time, device reliability may be marred.
Therefore, it is essential to complete soldering in the shortest time possible to prevent temperature of resin from rising.
(b) When employing halogen lamps or infrared-ray heaters
When halogen lamps or infrared-ray heaters are used, avoid direct irradiation onto resin surfaces; such devices
cause extensive localized temperature rise.
Please keep a reflow solder operating when SOT-89 package's soldering.
2002. 12. 31
Revision No : 2
4/4
383659001.047.png 383659001.048.png 383659001.049.png 383659001.050.png 383659001.052.png 383659001.053.png 383659001.054.png 383659001.055.png 383659001.056.png
Zgłoś jeśli naruszono regulamin