Pentium III Datasheet.pdf

Pentium ® III Processor at 450 MHz and

500 MHz

Datasheet

Product Features

• Available at 450 MHz and 500 MHz

• System bus frequency at 100 MHz

• Binary compatible with applications

running on previous members of the Intel

microprocessor line

• Dynamic execution micro architecture

• Dual Independent Bus architecture:

Separate dedicated external System Bus

and dedicated internal high-speed cache

bus

• Streaming SIMD Extensions for enhanced

video, sound and 3D performance

• Power Management capabilities

— System Management mode

— Multiple low-power states

• Optimized for 32-bit applications running

on advanced 32-bit operating systems

• Single Edge Contact Cartridge (S.E.C.C.)

and S.E.C.C.2 packaging technology; the

S.E.C. cartridges deliver high performance

with improved handling protection and

socketability

• Integrated high performance 16 KB

instruction and 16 KB data, nonblocking,

level one cache

• Available with integrated 512 KB unified,

nonblocking, level two cache

• Enables systems which are scaleable up to

two processors

• Error-correcting code for System Bus data

• Intel Processor Serial Number

The Pentium ® III processor is designed for high-performance desktops and for workstations and

servers. It is binary compatible with previous Intel Architecture processors. The Pentium III

processor provides the best performance available for applications running on advanced

operating systems such as Windows* 95, Windows NT and UNIX*. This is achieved by

integrating the best attributes of Intel processors—the dynamic execution, Dual Independent Bus

architecture plus Intel MMX™ technology—bringing a new level of performance for systems

buyers. The Pentium III processor is scaleable to two processors in a multiprocessor system and

extends the power of today’s Pentium II processor with performance headroom for business

media, communication and internet capabilities. Systems based on Pentium III processors also

include the latest features to simplify system management and lower the cost of ownership for

large and small business environments. The Pentium III processor offers great performance for

today’s and tomorrow’s applications.

Order Number: 244452-001

February 1999

Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual

property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability

whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to

fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not

intended for use in medical, life saving, or life sustaining applications.

Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for

future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.

The Pentium ® III processor may contain design defects or errors known as errata which may cause the product to deviate from published

specifcations. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

Copies of documents which have an ordering number and are referenced in this document, or other Intel literature may be obtained by calling 1-800-

548-4725 or by visiting Intel's website at http://www.intel.com.

*Third-party brands and names are the property of their respective owners.

Datasheet

Pentium ® III Processor at 450 MHz and 500 MHz

Contents

1.0

Introduction......................................................................................................................... 7

1.1

Terminology........................................................................................................... 8

1.1.1 S.E.C.C.2 and S.E.C.C. Packaged Processor Terminology .................... 8

1.2

References ............................................................................................................ 9

2.0

Electrical Specifications....................................................................................................10

2.1

Processor System Bus and VREF ...................................................................... 10

2.2

Clock Control and Low Power States ..................................................................11

2.2.1 Normal State—State 1 ........................................................................... 12

2.2.2 AutoHALT Powerdown State—State 2................................................... 13

2.2.3 Stop-Grant State—State 3 ..................................................................... 13

2.2.4 HALT/Grant Snoop State—State 4 ........................................................ 13

2.2.5 Sleep State—State 5 ..............................................................................14

2.2.6 Deep Sleep State—State 6 .................................................................... 14

2.2.7 Clock Control..........................................................................................14

2.3

Power and Ground Pins ...................................................................................... 15

2.4

Decoupling Guidelines ........................................................................................ 15

2.4.1 Processor VCC CORE Decoupling............................................................ 15

2.4.2 Processor System Bus AGTL+ Decoupling............................................ 16

2.5

Processor System Bus Clock and Processor Clocking ....................................... 16

2.5.1 Mixing Processors of Different Frequencies........................................... 16

2.6

Voltage Identification ........................................................................................... 16

2.7

Processor System Bus Unused Pins................................................................... 18

2.8

Processor System Bus Signal Groups ................................................................ 18

2.8.1 Asynchronous vs. Synchronous for System Bus Signals ....................... 19

2.8.2 System Bus Frequency Select Signal (BSEL0)...................................... 19

2.9

Test Access Port (TAP) Connection.................................................................... 20

2.10

Maximum Ratings................................................................................................ 20

2.11

Processor DC Specifications............................................................................... 21

2.12

AGTL+ System Bus Specifications ..................................................................... 24

2.13

System Bus AC Specifications ............................................................................ 25

3.0

System Bus Signal Simulations........................................................................................ 36

3.1

System Bus Clock (BCLK) Signal Quality Specifications and

Measurement Guidelines .................................................................................... 37

3.2

AGTL+ Signal Quality Specifications and Measurement Guidelines .................. 38

3.3

Non-AGTL+ Signal Quality Specifications and Measurement Guidelines........... 40

3.3.1 Overshoot/Undershoot Guidelines ......................................................... 41

3.3.2 Ringback Specification ........................................................................... 41

3.3.3 Settling Limit Guideline........................................................................... 41

4.0

Thermal Specifications and Design Considerations......................................................... 42

4.1

Thermal Specifications ........................................................................................ 43

4.1.1 Thermal Diode........................................................................................ 44

5.0

S.E.C.C. and S.E.C.C.2 Mechanical Specifications ......................................................... 45

5.1

S.E.C.C. Mechanical Specifications .................................................................... 45

Datasheet

Pentium ® III Processor at 450 MHz and 500 MHz

5.2

S.E.C.C.2 Mechanical Specification.................................................................... 52

5.3

S.E.C.C.2 Structural Mechanical Specification ................................................... 58

5.4

Processor Package Materials Information .......................................................... 60

5.5

Pentium ® III Processor Signal Listing ................................................................. 60

6.0

Boxed Processor Specifications....................................................................................... 67

6.1

Introduction ......................................................................................................... 67

6.2

Fan Heatsink Mechanical Specifications............................................................. 68

6.2.1 Boxed Processor Fan Heatsink Dimensions .......................................... 68

6.2.2 Boxed Processor Fan Heatsink Weight.................................................. 70

6.2.3 Boxed Processor Retention Mechanism ................................................ 70

6.3

Fan Heatsink Electrical Requirements ................................................................ 70

6.3.1 Fan Heatsink Power Supply ................................................................... 70

6.4

Fan Heatsink Thermal Specifications.................................................................. 72

6.4.1 Boxed Processor Cooling Requirements ............................................... 72

7.0

Pentium ® III Processor Signal Description....................................................................... 72

7.1

Alphabetical Signals Reference .......................................................................... 73

7.2

Signal Summaries ............................................................................................... 79

Figures

Second Level (L2) Cache Implementation ........................................................... 8

AGTL+ Bus Topology.......................................................................................... 11

Stop Clock State Machine................................................................................... 12

BSEL0 Pin Implementation Example .................................................................. 20

BCLK to Core Logic Offset .................................................................................. 33

BCLK, PICCLK, and TCK Generic Clock Waveform........................................... 34

System Bus Valid Delay Timings ........................................................................ 34

System Bus Setup and Hold Timings.................................................................. 34

System Bus Reset and Configuration Timings.................................................... 35

Power-On Reset and Configuration Timings....................................................... 35

Test Timings (TAP Connection) .......................................................................... 36

Test Reset Timings ............................................................................................. 36

BCLK, TCK, PICCLK Generic Clock Waveform at the Processor

Core Pins ............................................................................................................ 37

BCLK, TCK, PICCLK Generic Clock Waveform at the Processor

Edge Fingers ....................................................................................................... 38

Low to High AGTL+ Receiver Ringback Tolerance............................................. 40

Non-AGTL+ Overshoot/Undershoot, Settling Limit, and Ringback ..................... 40

S.E.C.Cartridge — 3-Dimensional View.............................................................. 42

S.E.C.Cartridge 2 — Substrate View .................................................................. 43

S.E.C.C. Packaged Processor — Multiple Views ............................................... 46

S.E.C.C. Packaged Processor — Extended Thermal Plate Side

Dimensions ......................................................................................................... 46

S.E.C.C. Packaged Processor — Bottom View Dimensions .............................. 47

S.E.C.C. Packaged Processor — Latch Arm, Extended Thermal

Plate Lug, and Cover Lug Dimensions................................................................ 47

S.E.C.C. Packaged Processor — Latch Arm, Extended Thermal

Plate, and Cover Detail Dimensions (Reference Dimensions Only) ................... 48

S.E.C.C. Packaged Processor — Extended Thermal Plate Attachment

Detail Dimensions ............................................................................................... 49

Datasheet

Pentium ® III Processor at 450 MHz and 500 MHz

S.E.C.C. Packaged Processor — Extended Thermal Plate Attachment

Detail Dimensions, Continued ............................................................................. 50

S.E.C.C. Packaged Processor Substrate — Edge Finger Contact

Dimensions.......................................................................................................... 50

S.E.C.C. Packaged Processor Substrate — Edge Finger Contact

Dimensions, Detail A ........................................................................................... 51

Pentium ® III Processor Markings (S.E.C.C. Packaged Processor).....................51

S.E.C.C.2 Packaged Processor — Multiple Views.............................................. 52

S.E.C.C.2 Packaged Processor Assembly — Primary View ............................... 53

S.E.C.C.2 Packaged Processor Assembly — Cover View with

Dimensions.......................................................................................................... 53

S.E.C.C.2 Packaged Processor Assembly — Heat Sink Attach

Boss Section ....................................................................................................... 54

S.E.C.C.2 Packaged Processor Assembly — Side View .................................... 54

Detail View of Cover in the Vicinity of the Substrate Attach Features ................. 55

S.E.C.C.2 Packaged Processor Substrate — Edge Finger Contact

Dimensions.......................................................................................................... 55

S.E.C.C.2 Packaged Processor Substrate — Edge Finger Contact

Dimensions (Detail A)..........................................................................................56

S.E.C.C.2 Packaged Processor Substrate — Keep In Zones............................. 56

S.E.C.C.2 Packaged Processor Substrate — Keep-Out Zone............................ 57

Pentium ® III Processor Markings (S.E.C.C.2 Package) ...................................... 58

Substrate Deflection Away From Heat Sink ........................................................ 59

Substrate Deflection Toward the Heatsink .......................................................... 59

S.E.C.C.2 Packaged Processor Specifications ................................................... 59

Boxed Pentium ® III Processor in the S.E.C.C.2 Packaging

(Fan Power Cable Not Shown)............................................................................ 68

Side View Space Requirements for the Boxed Processor with

S.E.C.C.2 Packaging........................................................................................... 68

Front View Space Requirements for the Boxed Processor with

S.E.C.C.2 Packaging........................................................................................... 69

Top View Air Space Requirements for the Boxed Processor.............................. 69

Boxed Processor Fan Heatsink Power Cable Connector Description................. 71

Recommended Baseboard Power Header Placement Relative to Fan

Power Connector and Pentium ® III Processor ....................................................71

Tables

Voltage Identification Definition ........................................................................... 17

System Bus Signal Groups ................................................................................. 19

Absolute Maximum Ratings................................................................................. 21

Voltage and Current Specifications ..................................................................... 22

AGTL+ Signal Groups DC Specifications............................................................ 24

Non-AGTL+ Signal Group DC Specifications...................................................... 24

AGTL+ Bus Specifications .................................................................................. 25

System Bus AC Specifications (Clock) at the Processor Edge

Fingers ................................................................................................................ 26

System Bus AC Specifications (Clock) at Processor Core Pins..........................27

Valid System Bus, Core Frequency, and Cache Bus Frequencies .....................27

System Bus AC Specifications (AGTL+ Signal Group) at the

Processor Edge Fingers...................................................................................... 28

Datasheet

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