PCF5079.pdf
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INTEGRATED CIRCUITS
DATA SHEET
PCF5079
Dual-band power amplifier
controller for GSM, PCN and DCS
Product specification
File under Integrated Circuits, IC17
2001 Nov 21
Philips Semiconductors
Product specification
Dual-band power amplifier controller for
GSM, PCN and DCS
PCF5079
CONTENTS
13
PACKAGE OUTLINES
14
SOLDERING (TSSOP10)
1
FEATURES
14.1
Introduction to soldering surface mount
packages
2
APPLICATIONS
3
GENERAL DESCRIPTION
14.2
Reflow soldering
14.3
Wave soldering
4
QUICK REFERENCE DATA
14.4
Manual soldering
5
BLOCK DIAGRAM
14.5
Suitability of surface mount IC packages for
wave and reflow soldering methods
6
PINNING
6.1
Pin description
15
SOLDERING (HVSON10)
6.2
Pin configurations
15.1
Soldering information
7
FUNCTIONAL DESCRIPTION
15.2
PCB design guidelines
7.1
General
15.2.1
Perimeter pad design
7.2
Power-up mode
15.2.2
Thermal pad and via design
7.3
OP4 (integrator)
15.2.3
Stencil design for perimeter pads
7.4
Start-up and initial conditions
15.2.4
Stencil design for thermal pads
7.5
Home position voltage
15.2.5
Stencil thickness
7.6
End of burst
16
DATA SHEET STATUS
7.7
Considerations for ramp-down
17
DEFINITIONS
7.8
Configurations
18
DISCLAIMERS
7.9
Summary of current and voltage definitions
7.10
Timing
8
LIMITING VALUES
9
ELECTROSTATIC DISCHARGE (ESD)
10
DC CHARACTERISTICS
11
OPERATING CHARACTERISTICS
12
APPLICATION INFORMATION
12.1
Ramp control
12.2
PA protection against mismatch
12.3
Detected voltage measurement
12.4
Application examples
2001 Nov 21
2
Philips Semiconductors
Product specification
Dual-band power amplifier controller for
GSM, PCN and DCS
PCF5079
1
FEATURES
2
APPLICATIONS
·
Compatible with baseband interface family PCF5073x
·
Global System for Mobile communication (GSM)
Two power sensor inputs
Personal Communications Network (PCN) systems.
·
·
·
Temperature compensation of sensor signal
3
GENERAL DESCRIPTION
·
Active filter for Digital-to-Analog Converter (DAC) input
·
Power Amplifier (PA) protection against mismatching
This CMOS device integrates an amplifier for the detected
RF voltage from the sensor, an integrator and an active
filter to build a PA control loop for cellular systems with a
small number of passive components.
·
Bias current source for detector diodes
·
Generation of pre-bias level for PA at start of burst
(home position)
·
Compatible with a wide range of silicon PAs
·
Compatible with multislot class 12
·
Dual output with internal switch
·
Two different transfer functions
·
Possibility to adapt dynamic transfer functions
·
Very small outline package (3
´
3 mm).
4
QUICK REFERENCE DATA
SYMBOL
PARAMETER
MIN.
TYP.
MAX.
UNIT
V
DD
supply voltage
2.5
3.6
5.0
V
I
DD(tot)
total supply current
-
-
10
mA
T
amb
ambient temperature
-
40
-
+85
°
C
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME
DESCRIPTION
VERSION
PCF5079T/C/1
TSSOP10
plastic thin shrink small outline package; 10 leads; body width 3 mm
SOT552-1
PCF5079HK/C/1
HVSON10
plastic, heatsink very thin small outline package; no leads;
10 terminals; body 3
SOT650-1
´
3
´
0.90 mm
2001 Nov 21
3
Philips Semiconductors
Product specification
Dual-band power amplifier controller for
GSM, PCN and DCS
PCF5079
5
BLOCK DIAGRAM
handbook, full pagewidth
RF
in
RF
out
RF
in
RF
out
PA
PA
D2
D1
CINT1
CINT2
VS2
VS1
VINT(N)
VCD
VCG
5
4
2
3
1
S1
SF
D
C1
SF
G
6 pF
C4
10 pF
I
bias2
I
bias1
PU
OP1
PU
D
C2
S5
R1
PU
OP4
6 pF
20 k
W
OP4
D
OP1
PU
G
30
m
A
V
DD
30
m
A
V
DD
OP4
IN
OP4
OP4
G
PU
filter
C3
BAND GAP
AND CURRENT
REFERENCE
PU
ref
16.6 pF
G = 0.3
PCF5079
V
DD
V
DD
PU/PD
commands
10
m
A
10
m
A
S4
S3
phases
V
home
V
prebias
VDAC
V
DD
R4
6 k
W
CONTROL
LOGIC
V
SS
V
SS
7
6
10
8
9
VDAC
V
SS
V
DD
PU
BS
MGT325
AUXDAC3
PCF5073x
Fig.1 Block diagram.
2001 Nov 21
4
Philips Semiconductors
Product specification
Dual-band power amplifier controller for
GSM, PCN and DCS
PCF5079
6
PINNING
6.1
Pin description
SYMBOL
PIN
TYPE
(1)
DESCRIPTION
VCG
1
O and A
PA control voltage output (GSM)
VINT(N)
2
I and A
negative integrator input
VCD
3
O and A
PA control voltage (DCS)
VS1
4
I/O and A
sensor signal input 1
VS2
5
I/O and A
sensor signal input 2
V
SS
6
G
reference ground
VDAC
7
I and A
DAC input voltage
PU
8
I and D
power-up input
BS
9
I and D
band selection input
V
DD
10
P
positive supply voltage
Note
1.
O = output, I = input, I/O = input/output, A = analog, D = digital, P = power supply and G = ground
6.2
Pin configurations
handbook, halfpage
handbook, halfpage
VCG
V
DD
1
10
VS2
V
SS
VDAC
5
6
VINT(N)
2
9
BS
VS1
4
7
VCD
3
PCF5079T
8
PCF5079HK
PU
VCD
3
8
PU
BS
VINT(N)
VCG
2
1
9
VS1
4
7
VDAC
V
DD
10
VS2
5
6
V
SS
MGT326
MGU268
Fig.2
Pin configuration (top view) for PCF5079T,
pins are numbered counter-clockwise.
Fig.3
Pin configuration (bottom view) for
PCF5079HK, pins are numbered clockwise.
2001 Nov 21
5
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