Modul Pamieci Binatone Carrera A350.pdf

M-Systems DOC H3

Embedded Flash Drive (EFD) featuring Embedded TrueFFS ®

Flash Management Software

Data Sheet, January 2006

H IGHLIGHTS

DOC H3 is a high capacity Embedded Flash

Drive (EFD) designed for mobile handsets and

consumer electronics devices, utilizing

multiple NAND flash technologies. All

DiskOnChip devices, regardless of flash

technology and density, are ball to ball

compatible. DOC H3 is backward compatible

with existing DiskOnChip products. Customers

that follow the DiskOnChip G3/P3, G4 and H1

to DOC H3 migration guide can use DOC H3

as a drop in replacement for existing

DiskOnChip devices.

DOC H3 is the new generation of the

successful DiskOnChip product line, enabling

tens of millions of handsets and other mobile

devices since the year 2000. It offers extreme

reliability and a high performance system

solution. A high level of reliability is

guaranteed by the field proven TrueFFS flash

management software, even in cases of power

failure.

newer and more cost effective NAND

technology.

The embedded flash management offered by

TrueFFS means there is no need to modify and

re-qualify the software on the host system, or

update mass production tools.

DOC H3 includes improved system boot

support enabled via a 32KB XIP boot block

and advanced paging mechanism (Paged Ram),

allowing for a total of up to 254KB XIP and

enabling the utilization of secure boot schemes.

This enables DOC H3 to handle system boot

code as well as data storage, eliminating the

need for an extra NOR flash device and

subsequently further reducing the bill of

materials, PCB real estate and overall power

consumption.

DOC H3 introduces many additional

performance and power consumption

enhancing features, including advanced data

and code protection features unmatched by any

raw NAND or EFD to date.

TrueFFS is now embedded within the DOC H3

device and can be run directly from the device,

eliminating the need for complicated software

integrations and practically enabling Plug &

Play integration.

DOC H3 with Embedded TrueFFS handles all

the complexity of flash management. This

dramatically simplifies Host software

integration and testing. It also allows for cost

reductions to be achieved in projects using

DiskOnChip by upgrading to newer

generations of DiskOnChip devices based on

Data Sheet (Preliminary) Rev. 0.1

92-DS-1205-10

M-Systems DOC H3 Embedded Flash Drive

DOC H3 is available in densities ranging from

1Gb (128MB) to 16Gb (2GB) with SLC

NAND and MLC NAND. It is also available in

various Multiple Chip Package (MCP)

configurations with DDR, SDR or PSRAM.

Read/Write Cache

Unrivaled data integrity with a robust 6 bit

Error Detection Code/Error Correction Code

(EDC/ECC) specifically tailored for the most

advanced flash technology.

Maximized flash endurance with TrueFFS

advanced flash management software.

Reduced complexity for the host system by

moving flash management functionality to

the device.

Plug & Play integration with the host

system, due to embedding TrueFFS within

the device itself.

Support for major mobile operating

systems (OSs), including Symbian OS,

Windows Mobile, Windows CE, Linux and

more.

Compatibility with major mobile CPUs

Performance:

Sustained write: 4 MB/sec.

Sustained read: 10 MB/sec

DOC H3 is a complete and optimal EFD

solution for fast time-to-market, high

reliability, high performance, optimized cost

and advanced features.

DOC H3 provides:

Flash disk for both code and data storage

Code and data storage protection

Low voltage:

1.8V core and I/O

3.3V Core and 3.3V/1.8V I/O (auto-detect)

Current Consumption

Active mode: 30mA

Power Save mode

Deep Power-Down mode: 45uA

Standby mode

1Gb (128MB) – 16Gb (2GB) data storage

capacity, with device cascading options for

up to 32Gb (4GB).

Enhanced Programmable Boot Block

(32KB) enabling eXecute In Place (XIP)

functionality using 16-bit access.

Small form factors:

DOC H3 1Gb/2Gb - 115-ball Fine-

Pitch Ball Grid Array (FBGA)

9x12mm.

DOC H3 4Gb/8Gb/16Gb - 143-ball

Fine-Pitch Ball Grid Array

(FBGA) 12x18mm

Ball to ball compatible with

DiskOnChip G3/G4/H1 product

families.

Enhanced performance by implementation

of:

P ROTECTION & S ECURITY -

E NABLING

16-byte Unique Identification (UID)

number.

32-bit Random number Generator (RNG).

10 configurable protected partitions for

data and code:

Read protected

Write protected

Read and Write protected

One Time Programmable (OTP)

Protection key and LOCK# signal

Sticky Lock (SLOCK) to lock boot

partition

Protected Bad Block Table.

Multi-plane operations

DMA support

MultiBurst operation

Dual Data RAM buffering

R ELIABILITY AND D ATA I NTEGRITY

Hardware on-the-fly 6-bit Error Detection

Code/Error Correction Code (EDC/ECC),

Data Sheet (Preliminary) Rev. 0.1

92-DS-1205-10

M-Systems DOC H3 Embedded Flash Drive

based on a BCH algorithm, tailored for the

most advanced flash technology.

Guaranteed data integrity after power

failure.

Transparent bad-block management.

Dynamic and static wear-leveling.

E MBEDDED T RUE FFS S OFTWARE

TrueFFS (True Flash File System) is M-

Systems’ acclaimed and field proven patented

flash management software. TrueFFS is

embedded within the DOC H3 device,

providing full Block Device functionality to

the Operating System (OS) file system via the

DOC driver. TrueFFS allows for DOC H3 to

appear to the OS as a regular hard drive, while

at the same time transparently providing robust

flash media management.

DOC driver provides full block device

emulation for transparent file system

management

Disk-like interface

Dynamic virtual mapping

Automatic bad block management

Dynamic and static wear-leveling

Programming, duplicating and testing tools

available in source code

B OOT C APABILITY

32KB Programmable Boot Block with XIP

capability to replace boot ROM or NOR.

254KB Paged RAM IPL.

Download Engine (DE) for automatic

download of boot code to the

Programmable Boot Block.

Asynchronous Boot mode to enable ARM-

based CPUs, e.g. TI OMAP, Intel PXAxxx,

to boot without the need for external glue

logic.

Exceptional boot performance with

MultiBurst operation and DMA support

enhanced by external clock.

O PERATING E NVIRONMENT

Wide OS support, including:

Symbian OS

Windows Mobile

Windows CE

Linux

Nucleus

OSE

PalmOS

Vxworks

Integrity

QNX

DOC driver Software Development Kit

(SDK) for quick and easy support for

proprietary OSs, or OS-less environment.

H ARDWARE C OMPATIBILITY

Configurable interface: simple SRAM-like

or multiplexed address/data interface.

CPU compatibility, including:

ARM-based CPUs

Texas Instruments OMAP, DBB

Intel PXAxxx family

Infineon xGold family

Analog Devices (ADI) digital

Baseband devices

Freescale i.MXxx Application

processors and i.xx digital

Baseband devices

Zoran ER4525

Renesas SH mobile

EMP platforms

Qualcomm MSMxxxx

Hitachi SuperH™ SH-x

Supports 16 and 32-bit architectures

C APACITY AND P ACKAGING

1Gb (128MB) – 16Gb (2GB) capacity,

with device cascading option for up to two

devices (32Gb).

Data Sheet (Preliminary) Rev. 0.1

92-DS-1205-10

M-Systems DOC H3 Embedded Flash Drive

FBGA package: 115 balls, 9x12x1.2 mm

(width x length x height)

FBGA package: 143 balls, 12x18x1.4 mm

(width x length x height).

Ball-out compatible with DiskOnChip G3,

G4 and H1 products: Refer to Migration

Guide DiskOnChip G3-P3 G3P3-LP G4

H1 to DOC H3 for further details.

Data Sheet (Preliminary) Rev. 0.1

92-DS-1205-10

M-Systems DOC H3 Embedded Flash Drive

R EVISION H ISTORY

Doc. No

Revision

Date

Description

Reference

92-DS-1205-10

1.0

January 2006

Preliminary version

Data Sheet (Preliminary) Rev. 0.1

92-DS-1205-10

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